Gate.Io Arbitrage

Maintaining 2-3 work shifts to ensure every piece of PCB/IC substrate ordered is completed on time and as specified.

Backed by a pool of talented front-end and CAM engineers to provide the best solutions for HDI or IC packaging projects.

With complete in-house production facility, including fully automated InCAM system, AOI and other advanced equipment.

Operating round the clock to meet every single or multilayer board prototype required by the customer.

Faster turnover rates offers the best alternative for electronic design or manufacturing service companies working on tight deadlines.

The Latest updated technologies and materials for 5G communication device,aviation and military
(as of Apr.30,2024)

PCB embedded coin technology for those designs need a high efficiency of thermal dissipation
High frequency PTFE Ceramic,Polyimide based material in stock;RO3000 and RO 4000 series RT6012,RT5870/5880,TMM10i,Arlon 85N,32N, tachyon 100G..etc,
Panasonic Megtron 6,7 and 8 for those Networking equipment s require an extremely low transmission loss for high Speed communication
Semiconductor testing boards Probe cards and Load boards with high pin counts with fine BGA pitch down to 0.15 mm. The closest distance between the rims of vias to circuitries is by 2.50 mils
Rigid-Flex Circuits layer buildups encompasses the asymmetrical 1F3R,2F3R,3F7R and the symmetrical 2F4R,2F6R with blind/buried vias on the combination of Rigid-Flex circuits
Laser drill and Laser direct Imaging
One-stop for PCB prototype and Assembly

Layer count	Fastest turnaround time (no. of working days)	Order size (sq-in)
2-6	2	up to 2000
8-12	3	up to 1500
14-18	4	up to 1000
20-above	5	up to 500

1.The copper surfaces are brown oxied.
2.the laser drill holes created with the method of Direct Laser Drill.
3.The conformal laser drill holes shapes are microsectioned and inspected with microscope (CY-930A).
4.The Brown oxide (0.35-0.45 mil thick) are removed from the copper surfaces.
5.The hydrocrabon residues on captures pads are removed by Plasma desmear.
6.The surfaces of captures pads are examined by LaserVia AOIM(MACHVSION).
7.Chemical desmear Alkaline permanganate cycle and panel plating are succeeded by Plasma Desmear.
8.The laser drill holes at sequential build-up are plated shut by copper plating like 4+N+4 or (ALIVH).